$WOLF · 海外大V持仓追踪

$WOLF 现在是什么情况？

最近有人说了 $WOLF 什么？

下面是最近 8 条提及 $WOLF 的公开帖，按时间倒序。每条都附原帖链接，可自行核对。

• 2026-06-08看多
  好了各位，这是你们最喜欢的800V直流相关标的汇总清单： 1. $IFNNY - 1158亿美元 2. $ON - 462亿 3. 光宝科技(2301) - 160.3亿 4. 6504.T - 141亿 5. $VICR - 128亿 6. $LFUS - 115.7亿 7. （链接）- 83.4亿 8. $VSH - 78.6亿 9. $ENPH - 73.6亿 10. $NVTS - 57.7亿 11. $POWI - 43亿 12. $BDC - 41.8亿 13. $EOSE - 38.6亿 14. $SEDG - 38.2亿 15. $AEHR - 31亿 16. 6890.T - 26.6亿 17. $WOLF - 21.6亿 18. $CWR.L - 17.5亿 19. $AMSC - 16.8亿 20. （链接）- 16.8亿 21. $XFAB - 15.4亿 22. $AOSL - 12.5亿 23. $HYLN - 12.3亿 24. $FCEL - 8.35亿 25. $IQE.L - 7.8亿 26. $ASYS - 2.76亿 27. $RELL - 2.39亿 28. 6844.T - 2.22亿 29. 4973.T - 2.07亿 30. $PAY.BR - 1.89亿 31. 6616.T - 1.86亿 32. 6882.T - 1.24亿 33. $IPWR - 9600万 你们提的 $FCEL、$EOSE 这类相关的也放进来了，虽然不确定是好敞口。明显不相关的比如 $POET 就忽略了。 评论有500多条，但X限制了我能看到的。 我们看看你们信念最高的想法表现如何。
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• 2026-05-27中性原文
  Bro media… how is $XFAB a meme stock? Can you not repeat the same mistake with $RPI this time? They’re literally getting CHIPS ACT funding from the EU because of how critical they are. And have $NVDA / $NOK evaluating their SiPH side of things, while they traded at a low ~1.28 P/B. This just reminded me of $SOI low p/b but high growth verticals out of legacy segment drag. $XFAB was literally mentioned for CHIPS ACT 2 next week in the blueprints… Which focuses around photonics. The main revenue ramp was around power semis with $NVDA pushing 800 vdc. So $NVTS, $POWI, $WOLF and everyone have been taking off recently. Markets just missed $XFAB, because they’re a lesser known foundry in power semis…But US Dpt. Of commerce pointed them out as the only high volume SiC foundry in the US 2Y ago. I just happened to point out the connections. Just because you don’t understand something, don’t just go call it a “meme stock” with price detached from fundamentals.
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• 2026-05-24看多原文
  All right chat, crowdsourcing your #1 highest conviction (10x only) stock long for the Power Semi trade. Especially given $NVDA pushing shift to 800 VDC. Stuff like $NVTS or $WOLF, but high-beta, 10x potential only. Anywhere around the world. What's your pick? https://t.co/Y10KR6HLVC
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• 2026-03-24看多原文
  US Chip ACT Funding is one of the largest signals. For importance to America National Security. Lesser known list: 1. $SIVE ($330m) 2. $AKTS ($920m) 3. $BLG ($34m) 4. $QUBT ($1.65B) 5. $RGTI ($5.27B) 6. $MRAM ($210m) 7. $SKYT (Acquired) 8. $PDFS ($1.35B) 9. $ATOM ($177M) 10. $SLVC ($227M) 11. $NVTS ($2.12B) 12. $WOLF ($750m) 13. $ALMU ($234m) 14. $ACLS ($2.6B) DIRECT FUNDING | DoC CHIPS PMTs: 1. $WOLF (Wolfspeed): $750 Million 2. $INFN (Infinera): $93 Million (DoC PMT) - Bought by Nokia 3. $SKYT (SkyWater Technology): $16 Million (DoC PMT) - Bought by IonQ DIRECT FUNDING | Federal R&D Contracts: 4. $RGTI (Rigetti Computing): $11.28M (AFRL/quantum networking and AFOSR Chip fab) 5. $QUBT - Direct DoC/NIST contract for TFLN PICs DoD Microelectronics / Sub-Contractors 6. $SIVE: $11.6 Million (NEMC Hub) 7. $MRAM - $8.7 Million project partner ("CHEETA" project via SCMC Hub) 8. $ACLS - $7.8M partner project (Led by GE Aerospace via CLAWS) 9. $BLG - $6.5M (DoD sub-contracts secured to date via CLAWS Hub) 10. $AKTS - $4 Million (Lead grant for the "LADDER" project via NEMC) Adjacents: 11. $ATOM: Member of the SWAP Hub 12. $NVTS: Embedded partner in the SCMC Hub 13. $PDFS: industry partner in the CA DREAMS Hub 14: $ALMU: affiliate member in the CA DREAMS and MMEC Hubs -> Electromagnetic Warfare (EW): $51 million allocated across 6 projects. -> Artificial Intelligence (AI) Hardware: $42 million allocated across 7 projects. -> 5G/6G Wireless Communications: $42 million allocated across 5 projects. -> Commercial Leap-Ahead Technologies: $38 million allocated across 7 projects. -> Quantum Technology: $32 million allocated across 4 projects. -> Secure Edge Computing / IoT: $25 million allocated across 4 projects. Just a warning: Being important to US technology (eg. Wolfspeed) does not translate to being a good investment. Was just doing research into $SIVE CHIPS act funding and decided to see what other lesser known companies got grants or were beneficaries too.
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• 2026-01-24看空原文
  $WOLF ($464M) is the paradigm of the "Bear-Bull" Paradox. Wolfspeed is the holy grail of AI with SiC wafers. And this foundry just made the world’s first 300mm single-crystal SiC wafer last week. $NVDA Rubin + architectures likely need 300mm SiC interposers and Wolfspeed is the only company in the world currently that can do it. They're critical to US national security with $750M+ in chips act grants. I listed this as a bottleneck but here's the catch: This is a negative EV trap: - $926M cash, $2.1B debt, $465m MC Ev would be roughly ~$1.6B. Then you have -> Convertible Notes #1 ~$331.4 Million. Convertible into New Common Stock based on an implied equity value of $1.0 Billion. -> Renesas Convertible Notes #2 ~ $204 Million. (13.6% of the total shares) December 15, 2025, Wolfspeed filed a prospectus to register 11.3 million shares for "selling stockholders" These are the former creditors who took equity instead of cash during the bankruptcy. So... Wolfspeed is central to the SiC Interposer thesis for 2027 as they're made in America and are have a massive moat. But this just looks like a trap right unless they can get this to massive scale and overshadow any convertibles, debt, and dilution. This is on paper the holy grail of AI moonshots since they have the world's first 300mm SiC wafer and are a monopoly in as a US company. But financially this is a landmine. Disclosure: I own no positions, just wanted to post my findings.
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• 2026-01-24中性原文
  @__EthanHunt__ I listed $WOLF in my list of potential bottlenecks, and the company genuinely is interesting. But there's a difference between "bottleneck" and good investment. Felt my the DD I did would go to waste, so ended up just posting it. https://t.co/XCICxxODXQ
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• 2026-01-24中性原文
  @foogleman1234 That's probably convertible note arbitrage with $WOLF
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• 2026-01-24中性原文
  The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - SiC defect inspection $ONTO - Panel-level packaging + inspection $AMAT - SiC deposition $AEHR - SiC inspection $ENTG - CMP $BESI (AS) - Hybrid Bonding equipment Disco - 70-80% marketshare precision cutting SiC Wafers: $WOLF - 300mm SiC wafers. $COHR - 150mm and 200mm SiC, still developing SK Siltron CSS (KRX: 034730) - Building to 200mm Resonac (4004 TYSE) - SmartSiC bonding NGK Insulators - Crystal growth Kyocera - SiC and ceramic packaging These are all early supply chain + active research. So when does this timeline hit? 2025-2026 (Blackwell Ultra): Continued reliance on Silicon Interposers 2027 (Rubin / Rubin Ultra): Introduction of SiC interposers in the highest-end AI SKUs. 2028+: Glass Substrates/SiC/Diamond Interposers? Disclosure: I own $AMKR, $AEHR, $ONTO, $COHR and $TSM above.
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